Advancing photonics,
one photon at a time.

We design, fabricate, and package photonic components — with a particular focus on customized VCSELs and VCSEL arrays tailored to each partner's wavelength, power, and packaging requirements.

A photonics engineering house

Vertical Photonics is a specialist developer of photonic semiconductor components. Our team has deep expertise across the full stack — from device physics and epitaxial growth through to wafer-level test, packaging, and qualification — applied to real problems in sensing, communications, imaging, and industrial lighting.

We pride ourselves on being approachable and technically honest. Customization is at the core of our work — every VCSEL and VCSEL array we deliver is tailored to your specification. Whether you're a research group needing a handful of bespoke devices or an OEM looking for a reliable supply of packaged emitters, we're set up to support you at every stage.

Semiconductor Photonics Optoelectronics System Integration R&D Consulting

Mission & vision

Our vision

Light is becoming the primary medium for sensing, computing, and communication. We believe the next decade of breakthroughs will be built on photonic building blocks — and we want to be the partner those builders trust.

Our values

The principles that shape how we design, manufacture, and engage with customers.

01

Engineering rigor

Every device we ship is characterized and traceable. No hand-waving — just data: L-I-V curves, spectra, reliability stress, and full lot documentation.

02

Partnership mindset

We treat your roadmap like our own. Our process is collaborative, transparent, and NDA-friendly from day one.

03

Responsive execution

Fast feedback loops. Rapid prototyping turnaround. Direct access to the engineers doing the work — not a layer of account managers.

End-to-end photonic development

A snapshot of the infrastructure we bring to every project.

01

Device design

Semiconductor device modeling, epi-stack design, and electro-optical simulation for LEDs, VCSELs, and photodiodes.

02

Wafer & die test

Probe-station characterization, automated L-I-V, spectral, and beam-profile measurements on bare die and packaged parts.

03

Assembly & bonding

Eutectic & epoxy die attach, Au & Al wire bonding, ribbon bonding, and flip-chip assembly.

04

Packaging

TO-cans, ceramic submounts, custom housings — hermetic and non-hermetic — up to small-series production.

From concept to qualified device

A lightweight, transparent process that flexes from one-off prototypes to repeatable production.

01

Scoping

Discovery call, spec capture, and feasibility assessment.

02

Design

Device & package design, simulation, and bill of materials.

03

Prototype

Short-loop fabrication, assembly, and characterization.

04

Scale

Qualification, process lock, and small-volume production.

Ready to collaborate?

Talk to our engineering team.

Whether you need a handful of prototype emitters or a repeatable supply of packaged devices — we'd love to hear what you're working on.

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