People
The team behind the photons
A focused group of engineers and scientists building the future of photonic technology.
Vertical Photonics is a specialist developer of photonic semiconductor components. Our team has deep expertise across the full stack — from device physics and epitaxial growth through to wafer-level test, packaging, and qualification — applied to real problems in sensing, communications, imaging, and industrial lighting.
We pride ourselves on being approachable and technically honest. Customization is at the core of our work — every VCSEL and VCSEL array we deliver is tailored to your specification. Whether you're a research group needing a handful of bespoke devices or an OEM looking for a reliable supply of packaged emitters, we're set up to support you at every stage.
A focused group of engineers and scientists building the future of photonic technology.
We exist to lower the barrier to custom photonic components. By combining engineering depth with flexible manufacturing, we help customers get from idea to qualified device without needing to stand up a fab of their own.
Light is becoming the primary medium for sensing, computing, and communication. We believe the next decade of breakthroughs will be built on photonic building blocks — and we want to be the partner those builders trust.
The principles that shape how we design, manufacture, and engage with customers.
Every device we ship is characterized and traceable. No hand-waving — just data: L-I-V curves, spectra, reliability stress, and full lot documentation.
We treat your roadmap like our own. Our process is collaborative, transparent, and NDA-friendly from day one.
Fast feedback loops. Rapid prototyping turnaround. Direct access to the engineers doing the work — not a layer of account managers.
A snapshot of the infrastructure we bring to every project.
Semiconductor device modeling, epi-stack design, and electro-optical simulation for LEDs, VCSELs, and photodiodes.
Probe-station characterization, automated L-I-V, spectral, and beam-profile measurements on bare die and packaged parts.
Eutectic & epoxy die attach, Au & Al wire bonding, ribbon bonding, and flip-chip assembly.
TO-cans, ceramic submounts, custom housings — hermetic and non-hermetic — up to small-series production.
A lightweight, transparent process that flexes from one-off prototypes to repeatable production.
Discovery call, spec capture, and feasibility assessment.
Device & package design, simulation, and bill of materials.
Short-loop fabrication, assembly, and characterization.
Qualification, process lock, and small-volume production.
Whether you need a handful of prototype emitters or a repeatable supply of packaged devices — we'd love to hear what you're working on.
